TY  - BOOK
AU  - Lau,John H.
AU  - Lee, S.W. Ricky
TI  -  Microvias : for low-cost, high-density interconnects
SN  - 0071363270 (hardcover)
PY  - 2001///
CY  - [S.l.]
PB  - McGraw-Hill Professional
KW  - Printed circuits	
KW  - Microelectronic packaging	
KW  - Semiconductors--Junctions	
KW  - Integrated circuits--Design and construction--Cost control	
KW  - Microelectronics--Materials	
KW  - Solder and soldering	
KW  - Solder and soldering--Testing	
KW  - Micro-drilling	
UR  - http://10.10.170.122:8080/browse/book/24493
ER  -