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  <titleInfo>
    <title> Microvias : for low-cost, high-density interconnects</title>
  </titleInfo>
  <name type="personal">
    <namePart>Lau, John H.</namePart>
    <role>
      <roleTerm authority="marcrelator" type="text">creator</roleTerm>
    </role>
  </name>
  <name type="personal">
    <namePart>Lee, S.W. Ricky</namePart>
  </name>
  <typeOfResource>text</typeOfResource>
  <originInfo>
    <place>
      <placeTerm type="text">S.l.]</placeTerm>
    </place>
    <publisher>McGraw-Hill Professional</publisher>
    <dateIssued>2001</dateIssued>
    <edition>1st ed.</edition>
    <issuance>monographic</issuance>
  </originInfo>
  <physicalDescription>
    <extent>565 p. ;</extent>
  </physicalDescription>
  <subject>
    <topic>Printed circuits	</topic>
  </subject>
  <subject>
    <topic>Microelectronic packaging	</topic>
  </subject>
  <subject>
    <topic>Semiconductors--Junctions	</topic>
  </subject>
  <subject>
    <topic>Integrated circuits--Design and construction--Cost control	</topic>
  </subject>
  <subject>
    <topic>Microelectronics--Materials	</topic>
  </subject>
  <subject>
    <topic>Solder and soldering	</topic>
  </subject>
  <subject>
    <topic>Solder and soldering--Testing	</topic>
  </subject>
  <subject>
    <topic>Micro-drilling	</topic>
  </subject>
  <identifier type="isbn">0071363270 (hardcover)</identifier>
  <identifier type="isbn">9780071363273 (hardcover)</identifier>
  <identifier type="uri">http://10.10.170.122:8080/browse/book/24493</identifier>
  <location>
    <url>http://10.10.170.122:8080/browse/book/24493</url>
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